HISTORY

NYS Leaders formally commit to the Albany site that is now headquarters of NY CREATES as the Center of Excellence in Nanoelectronics and Nanotechnology (CENN) a fully-integrated technology deployment, product prototyping, manufacturing support, and workforce training resource for emerging generations of integrated circuitry (IC).

With a major investment by New York State and industry partners, International SEMATECH announces it will establish its next generation 300mm computer chip research and development program at the Center of Excellence in Nanoelectronics at the Albany site.  This investment includes $400 million in State and Industry support over five years, consisting of $210 million from the State and $193 million from International SEMATECH and its member companies, including IBM. This collaborative investment by the State and industry set the stage for later relocation from Austin to Albany.

Leading companies in the semiconductor industry will participate in this multi-phase, joint R&D cooperative program on future computer chip technology nodes beginning with the 32nm computer chip device node includes major industry partners such as IBM, Advanced Micro Devices, SONY, Toshiba, Tokyo Electron, and Applied Materials.

IBM and New York leaders announce a new commitment at the Albany NY CREATES location to support a $125 million packaging facility – the Computer Chip Hybrid Integration Partnership (CHIP).  The new program will advance innovation, education and commercialization of computer chips in upstate New York.  The Albany research center will partner with companies such as IBM and SEMATECH to develop “system on a chip” (SOC) technologies.

NYS Leaders and Tokyo Electron announce $300 million investment in the TEL Technology Center America II, a renewal of the major supply chain R&D initiative at the NY CREATES Albany site.  This commitment renews the investment in the site by TEL for another seven years.

In partnership with MIT design start up, Analog Photonics, Albany facility develops first working Photonic Integrated Circuits (PIC) on 300mm silicon

Members of International SEMATECH and State leaders commit to a third round of the SEMATECH North program, investing $300 million to fund another five years of advanced manufacturing R&D at the NY CREATES Albany headquarters.

The formation of the New York Power Electronics Manufacturing Consortium (NY-PEMC), with GE as a lead partner, will help develop the next generation of materials used on semiconductors at the NY CREATES facilities in Albany. NY CREATES is providing support for operations, manufacturing and research and development activities of the NY-PEMC Silicon Carbide manufacturing line that will develop low cost, high performance 150 mm silicon carbide wafers.

Work begins on superconducting quantum computing device fabrication leveraging advanced 300mm process tools.

193nm optical lithography techniques on full 300mm silicon were used in the fabrication of transmon qubits that showed 25 microseconds of coherence time and tight control of qubit frequency.

NYS leaders and Tokyo Electron announce another $250 million investment to support a seven year reauthorization of the TEL Technology Center America.  This investment followed NYS investing $87 million in a grant grant to TEL to help it upgrade its clean room facilities at the Albany site of NY CREATES to develop chip manufacturing for sub-7 nanometer chip architecture.

Danfoss Silicon Power, one of the world’s leading, independent custom power module manufacturers, will occupy the entire Computer Chip Commercialization Center in Utica (QUAD-C) facility in Utica. This project supports and advances the New York Power Electronics Manufacturing Consortium, a public-private partnership along the Upstate corridor for development of the next generation of semiconductor materials and packaging. Danfoss Silicon Power will be manufacturing power modules for industrial products such as wind turbines, utility-scale solar inverters, data centers and electric cars.

Cisco validates 100Gbit design developed in Albany Fab.

AIM Photonics begins contruction of first ever open-access 300mm enabled Test, Assembly and Packaging (TAP) Facility for inegrated photonics. Facility will house state-of-the-art equipment to develop advanced testing, packaging, and assembly processes for integrated photonics community.

The $1.2 million U.S. Department of Defense (DoD) project, along with an additional $400 thousand in matching funds from a team led by the University of Arizona (UA), will support a consortium that includes Sandia National Labs, Raytheon (RTN) and other aerospace firms engaged in FPA technology.

January 11th, 2018 Worcester Polytechnic Institute and Quinsigamond Community College announced they would receive $4 million for a second LEAP facility on WPI’s campus. The LEAPS are funded by the Commonwealth of Massachusetts Manufacturing Innovation Initiative (M2I2) program to support AIM Photonics.

A new sensor for deadly sarin gas has been developed as a chemical warfare tool by an AIM Photonics team, with a goal of extending the technology to broader market applications. The team consisted of academic, industry, and government organizations.

The $1.7 million U.S. Department of Defense (DoD) project will support a consortium of AIM Photonics members led by University of California Santa Barbara (UCSB) and includes Northrop Grumman, the U.S. Naval Research Laboratory, and SUNY Polytechnic Institute.  The majority of development to date has focused on a relatively narrow wavelength range —around 1550nm. The goal of this government-directed project is to address the opportunities at longer wavelengths.

Academic institutions partner with AIM Photonics to realize advanced computing architecture using light; develop mobile probes for identifying specific materials; and enable improved manufacturing processes for photonic devices. Rochester Institute of Technology, University of California-San Diego, University of Delaware to Leverage AIM Photonics’ World-Class R&D and Foundry Capabilities.

Dr. Papa Rao, Prof. Cady and the NY CREATES team work towards artificial neuron circuits that communicate with 1.22 µm light and use superconducting Josephson junctions for energy-efficient operation at speeds 30,000 times faster than the brain’s neurons.

Governor Andrew Cuomo announces a $2 billion investment by NYS and IBM to grow the company’s high-tech footprint at NY CREATES and throughout New York State. New York State invests $300 million over five years to support the the establishment of an “AI Hardware Center” for artificial intelligence-focused computer chip research, development, prototyping, testing and simulation.

Cree, Inc., the global leader in silicon carbide technology, will construct and equip the world’s-first 200 mm silicon carbide wafer fabrication facility at the Marcy Nanocenter on the SUNY Polytechnic Institute campus near Utica. While construction is underway, Cree will lease space at NY CREATES, where the company will utilize equipment purchased as part of the New York Power Electronics Manufacturing Consortium (NY-PEMC) to transition from the current process of producing devices on 150 mm silicon carbide wafers to producing devices on 200 mm silicon carbide wafers.

AIM Photonics PDK v3.0 announced. Industry leaders recognize AIM PDK as industry leading. The release of Process Design Kit (PDK) v3.5 Compact Model Library sponsored by AIM Photonics is the first to support statistical models in Lumerical’s INTERCONNECT, introducing a set of statistical models based on the measured wafer-scale data of photonic components.

This project will establish a first-of-its-kind capability at 300mm wafer scale that will lead towards scalable quantum computing devices, with higher performance characteristics.

Mike Cumbo announced as new CEO and Executive in charge of AIM Photonics beginning July 1st, 2020.