Skip to content

HISTORY

The historical timeline highlights our R&D activity over the past three decades, starting with the founding of the New York Center for Advanced Thin Film Technology in 1993. Since then, the organization has evolved through many stages under different identities and grown to become the dynamic government, industry and academic collaborative initiative that is NY CREATES.

Governor Mario Cuomo designates Albany site as a Center for Advanced Technology (CAT), establishing the NYS Center for Advanced Thin Film Technology

Governor Mario Cuomo designates Albany site as a Center for Advanced Technology (CAT), establishing the NYS Center for Advanced Thin Film Technology

Leveraging a $10 million investment.  This is the first major New York State investment in the Albany site and would enable further investment, as the program merges with the CAT in Nanomaterials and Nanoelectronics.

NYS Leaders commit $5 million in State funds to match a $45 million commitment from DARPA to establish the Center for Advanced Interconnect Science and Technology (CAIST)

NYS Leaders commit $5 million in State funds to match a $45 million commitment from DARPA to establish the Center for Advanced Interconnect Science and Technology (CAIST)

The Center for Advanced Interconnect Science and Technology (CAIST) at the Albany site that is now headquarters of NY CREATES.  This $50 million program launched the Focus Center New York, with partners at University of Albany, RPI, Georgia Tech, Stanford and MIT.

Center of Excellence in Nanoelectronics and Nanotechnology (CENN) a fully-integrated technology deployment, product prototyping, manufacturing support, and workforce training resource for emerging generations of integrated circuitry (IC).

Center of Excellence in Nanoelectronics and Nanotechnology (CENN) a fully-integrated technology deployment, product prototyping, manufacturing support, and workforce training resource for emerging generations of integrated circuitry (IC).

NYS Leaders formally commit to the Albany site that is now headquarters of NY CREATES as the Center of Excellence in Nanoelectronics and Nanotechnology (CENN) a fully-integrated technology deployment, product prototyping, manufacturing support, and workforce training resource for emerging generations of integrated circuitry (IC).

Investment by Tokyo Electron in the new Tokyo Electron Technology Center Americas at the Albany headquarters of NY CREATES.

Investment by Tokyo Electron in the new Tokyo Electron Technology Center Americas at the Albany headquarters of NY CREATES.

NYS Leadership announces major investment in new supply chain and equipment development with an investment by Tokyo Electron in the new Tokyo Electron Technology Center Americas at the Albany headquarters of NY CREATES.  This $600 million investment transforms the facilities and programs in Albany with a renewed focus on the equipment industry, supply chain interconnectivity, and technology excellence in metrology and product development.

International SEMATECH announces it will establish its next generation 300 millimeter computer chip research and development program at the Center of Excellence in Nanoelectronics at the Albany site.

International SEMATECH announces it will establish its next generation 300 millimeter computer chip research and development program at the Center of Excellence in Nanoelectronics at the Albany site.

With a major investment by New York State and industry partners, International SEMATECH announces it will establish its next generation 300mm computer chip research and development program at the Center of Excellence in Nanoelectronics at the Albany site.  This investment includes $400 million in State and Industry support over five years, consisting of $210 million from the State and $193 million from International SEMATECH and its member companies, including IBM. This collaborative investment by the State and industry set the stage for later relocation from Austin to Albany.

$600 million International Venture for Nanolithography (INVENT) is created at the Albany headquarters of NY CREATES.

$600 million International Venture for Nanolithography (INVENT) is created at the Albany headquarters of NY CREATES.

With investments from NYS, AMD, IBM, Micron and Infineon, the $600 million International Venture for Nanolithography (INVENT) is created at the Albany headquarters of NY CREATES.  This international collaboration featured NYS investments of $180 million and industry invest of more than $420 million to develop the industry’s next major breakthrough in nanolithography.

Industry and NYS leaders announce the creation of the Center for Semiconductor Research (CSR), a $500 million partnership

Industry and NYS leaders announce the creation of the Center for Semiconductor Research (CSR), a $500 million partnership

Leading companies in the semiconductor industry will participate in this multi-phase, joint R&D cooperative program on future computer chip technology nodes beginning with the 32nm computer chip device node includes major industry partners such as IBM, Advanced Micro Devices, SONY, Toshiba, Tokyo Electron, and Applied Materials.

Advanced Micro Devices (AMD) has committed to building state of the art chip fabrication plant in nearby Malta, at the Luther Forest Technology Campus.

Advanced Micro Devices (AMD) has committed to building state of the art chip fabrication plant in nearby Malta, at the Luther Forest Technology Campus.

NYS and industry leaders announce major commitment at NY CREATES Albany Headquarters that Advanced Micro Devices (AMD) has committed to building state of the art chip fabrication plant in nearby Malta, at the Luther Forest Technology Campus.  With NYS investment of more than $1.2 billion, AMD agrees to invest $2 billion and create 2,000 jobs at the site. At the announcement, industry leaders tout New York’s ongoing investment in the people, programs, research, and facilities at what is now NY CREATES as the major driver of the investment.  AMD spun off their manufacturing shortly after this announcement to create GLOBALFOUNDRIES. ..Read More

IBM and New York leaders announce the Computer Chip Hybrid Integration Partnership

IBM and New York leaders announce the Computer Chip Hybrid Integration Partnership

IBM and New York leaders announce a new commitment at the Albany NY CREATES location to support a $125 million packaging facility – the Computer Chip Hybrid Integration Partnership (CHIP).  The new program will advance innovation, education and commercialization of computer chips in upstate New York.  The Albany research center will partner with companies such as IBM and SEMATECH to develop “system on a chip” (SOC) technologies.

$300 million to support the next round of International SEMATECH North

$300 million to support the next round of International SEMATECH North

NYS and industry leaders announce a new commitment of $300 million to support the next round of International SEMATECH North for five more years.

NYS Leaders and Tokyo Electron announce $300 million investment in the TEL Technology Center America II

NYS Leaders and Tokyo Electron announce $300 million investment in the TEL Technology Center America II

NYS Leaders and Tokyo Electron announce $300 million investment in the TEL Technology Center America II, a renewal of the major supply chain R&D initiative at the NY CREATES Albany site.  This commitment renews the investment in the site by TEL for another seven years.

The G450C is announced by NYS leaders and industry leaders, including Intel, Samsung and Taiwan Semiconductor Manufacturing Co. GlobalFoundries and IBM

The G450C is announced by NYS leaders and industry leaders, including Intel, Samsung and Taiwan Semiconductor Manufacturing Co. GlobalFoundries and IBM

This five year commitment focused on the major industry technology challenge of that era – exploring the transition to 450mm wafers.  NYS commits $400 million to leverage another $3.7 billion of industry investment to explore this massive industry challenge.

First silicon photonics devices developed in Albany facility

First silicon photonics devices developed in Albany facility

In partnership with MIT design start up, Analog Photonics, Albany facility develops first working Photonic Integrated Circuits (PIC) on 300mm silicon

New York and IBM invest another $300 million

New York and IBM invest another $300 million

New York and IBM invest another $300 million to renew the commitment to the Center for Semiconductor Research (CSR), extending the agreement for research and development for another seven years.

International SEMATECH and State leaders commit to $300 million to fund another five years of advanced manufacturing R&D

International SEMATECH and State leaders commit to $300 million to fund another five years of advanced manufacturing R&D

Members of International SEMATECH and State leaders commit to a third round of the SEMATECH North program, investing $300 million to fund another five years of advanced manufacturing R&D at the NY CREATES Albany headquarters.

Albany signs first Industrial Photonic Integrated Chip (PIC) partner

Albany signs first Industrial Photonic Integrated Chip (PIC) partner

Cisco systems signs agreement to develop their next generation 100Gigabit transcievers in Albany facilty.

New York State and GE Partner to Develop Next-Generation Power Electronics

New York State and GE Partner to Develop Next-Generation Power Electronics

The formation of the New York Power Electronics Manufacturing Consortium (NY-PEMC), with GE as a lead partner, will help develop the next generation of materials used on semiconductors at the NY CREATES facilities in Albany. NY CREATES is providing support for operations, manufacturing and research and development activities of the NY-PEMC Silicon Carbide manufacturing line that will develop low cost, high performance 150 mm silicon carbide wafers.

Governor Andrew Cuomo announces NY CREATES Partners Nikon and Tokyo Electron announce world’s first 450mm immersion photolithography tool

Governor Andrew Cuomo announces NY CREATES Partners Nikon and Tokyo Electron announce world’s first 450mm immersion photolithography tool

This critical milestone will enable G450C founding members and CNSE to perform 10 nanometer (1 nanometer is a billionth of a meter) and smaller size photolithography on full silicon wafers, while optimizing tool configuration and performance.  

Quantum Project Starts

Quantum Project Starts

Work begins on superconducting quantum computing device fabrication leveraging advanced 300mm process tools.

Albany and Rochester selected as headquarters for the next National Manufacturing Institute to advance integrated photonics

Albany and Rochester selected as headquarters for the next National Manufacturing Institute to advance integrated photonics

Vice President Joe Biden and Governor Andrew Cuomo announce that New York State is selected for $110 million of Federal funding for  AIM Photonics, in addition to $250 million of New York State funding.

World’s first transmon qubits fabricated using 193nm optical lithography

World’s first transmon qubits fabricated using 193nm optical lithography

193nm optical lithography techniques on full 300mm silicon were used in the fabrication of transmon qubits that showed 25 microseconds of coherence time and tight control of qubit frequency.

First DoD funded programs begin with AIM Photonics Members

First DoD funded programs begin with AIM Photonics Members

Over 80 AIM members begin research programs – both commercial and academic. First programs focused on Key Technology Manufacturing Areas and Manufacturing Centers of Excellence.

NYS leaders and Tokyo Electron announce another $250 million investment

NYS leaders and Tokyo Electron announce another $250 million investment

NYS leaders and Tokyo Electron announce another $250 million investment to support a seven year reauthorization of the TEL Technology Center America.  This investment followed NYS investing $87 million in a grant grant to TEL to help it upgrade its clean room facilities at the Albany site of NY CREATES to develop chip manufacturing for sub-7 nanometer chip architecture.

First Integrated Photonic Process Design Kit (PDK) and Multi Project Wafer (MPW) established

First Integrated Photonic Process Design Kit (PDK) and Multi Project Wafer (MPW) established

AIM photonics and Analog Photonics release Process Design Kit for integrated photonics focusing on Data Comm transcievers. The first MPW runs using this new PDK begin in Sept 2016

Danfoss to Establish New Manufacturing Operations in Utica

Danfoss to Establish New Manufacturing Operations in Utica

Danfoss Silicon Power, one of the world’s leading, independent custom power module manufacturers, will occupy the entire Computer Chip Commercialization Center in Utica (QUAD-C) facility in Utica. This project supports and advances the New York Power Electronics Manufacturing Consortium, a public-private partnership along the Upstate corridor for development of the next generation of semiconductor materials and packaging. Danfoss Silicon Power will be manufacturing power modules for industrial products such as wind turbines, utility-scale solar inverters, data centers and electric cars.

AIM Photonics first Technology Summit draws hundreds from around the globe

AIM Photonics first Technology Summit draws hundreds from around the globe

AIM Photonics presents cutting-edge integrated photonics technology development programs to packed house at OFC 2017, the Optical Networking and Communication Conference & Exhibition.

100Gbit Transceiver Created

100Gbit Transceiver Created

Cisco validates 100Gbit design developed in Albany Fab.

AIM Photonics launches its premiere Lab for Education & Application Prototypes (LEAP)

AIM Photonics launches its premiere Lab for Education & Application Prototypes (LEAP)

AIM Academy launched its Lab for Education & Application Prototypes (LEAP) on MIT’s campus in the spring of 2017. The LEAPS are funded by the Commonwealth of Massachusetts’ M2I2 program to support AIM Photonics.  They will enable (1)  the fabrication of prototypes and initial proof of manufacturing and (2) the creation of new high-tech integrated photonics manufacturing jobs.

Construction of AIM Photonics Test, Assembly and Packaging (TAP) facility begins

Construction of AIM Photonics Test, Assembly and Packaging (TAP) facility begins

AIM Photonics begins contruction of first ever open-access 300mm enabled Test, Assembly and Packaging (TAP) Facility for inegrated photonics. Facility will house state-of-the-art equipment to develop advanced testing, packaging, and assembly processes for integrated photonics community.

Integrated Photonics workforce development programs begin

Integrated Photonics workforce development programs begin

AIM Photonics announces workforce development programs at AIM Photonics Academy in Cambridge, MA at MIT. First weeklong summer training programs announced.

AIM announces participants of DoD sponsored integrated photonic cryogenic datalink for focal plane arrays

AIM announces participants of DoD sponsored integrated photonic cryogenic datalink for focal plane arrays

The $1.2 million U.S. Department of Defense (DoD) project, along with an additional $400 thousand in matching funds from a team led by the University of Arizona (UA), will support a consortium that includes Sandia National Labs, Raytheon (RTN) and other aerospace firms engaged in FPA technology.

First Photonic Integrated Chip (PIC) technology transfer program begins

First Photonic Integrated Chip (PIC) technology transfer program begins

Albany site begins first 300mm silicon photonic technology transfer to GlobalFoundries.

Commonwealth of Massachusetts invests in AIM Photonics and burgeoning integrated photonics industry across the Northeast

Commonwealth of Massachusetts invests in AIM Photonics and burgeoning integrated photonics industry across the Northeast

January 11th, 2018 Worcester Polytechnic Institute and Quinsigamond Community College announced they would receive $4 million for a second LEAP facility on WPI’s campus. The LEAPS are funded by the Commonwealth of Massachusetts Manufacturing Innovation Initiative (M2I2) program to support AIM Photonics.

AIM Photonics announces latest version of PDK to address High-Speed Optical Communications (50Gbps)

AIM Photonics announces latest version of PDK to address High-Speed Optical Communications (50Gbps)

In this release, Analog Photonics (AP) expanded the comprehensive set of Silicon Photonics Integrated Circuit (PIC) component libraries within SUNY Poly’s process to address the high-speed optical communication needs. Combined with Multi-Project Wafer (MPW) runs, this PDK will give AIM Photonics members access to world-class silicon photonics components.

AIM Photonics Members develop Sarin Gas Sensor

AIM Photonics Members develop Sarin Gas Sensor

A new sensor for deadly sarin gas has been developed as a chemical warfare tool by an AIM Photonics team, with a goal of extending the technology to broader market applications. The team consisted of academic, industry, and government organizations.

Dr. Douglas A. Grose is appointed to organize NY CREATES

Dr. Douglas A. Grose is appointed to organize NY CREATES

Dr. Grose, one of the most recognized executives in the semiconductor industry, assumes the leadership role for Albany Nanotech and the associated technology facilities and locations. His goal is to forge an organization which focuses on technology development with an emphasis on business.  NY CREATES will manage technology development programs at the Albany Nanotech facility, Rochester TAP facility, and other advanced research facilities across New York State.  

AIM Photonics announces program to develop a CMOS-compatible waveguide platform for integrating MWIR and LWIR laser sources

AIM Photonics announces program to develop a CMOS-compatible waveguide platform for integrating MWIR and LWIR laser sources

The $1.7 million U.S. Department of Defense (DoD) project will support a consortium of AIM Photonics members led by University of California Santa Barbara (UCSB) and includes Northrop Grumman, the U.S. Naval Research Laboratory, and SUNY Polytechnic Institute.  The majority of development to date has focused on a relatively narrow wavelength range —around 1550nm. The goal of this government-directed project is to address the opportunities at longer wavelengths.

Governor Andrew Cuomo and Applied Materials announce the META Center

Governor Andrew Cuomo and Applied Materials announce the META Center

The META Center is a $850 million new R&D institute at NY CREATES in Albany.  New York State will invest $250 million to leverage a $600 million, seven-year commitment from Applied Materials to fund materials engineering R&D, prototyping and pilot projects in fields like virtual intelligence, augmented and virtual reality, semiconductors and advanced optics. (Image courtesy Applied Materials)

NSF Awards $1.2M to AIM Photonics and academic partners to advance key technology programs

NSF Awards $1.2M to AIM Photonics and academic partners to advance key technology programs

Academic institutions partner with AIM Photonics to realize advanced computing architecture using light; develop mobile probes for identifying specific materials; and enable improved manufacturing processes for photonic devices. Rochester Institute of Technology, University of California-San Diego, University of Delaware to Leverage AIM Photonics’ World-Class R&D and Foundry Capabilities.

AIM Photonics Announces Best-in-Class 300mm Silicon Photonics Multi-Project Wafer (MPW) Performance

AIM Photonics Announces Best-in-Class 300mm Silicon Photonics Multi-Project Wafer (MPW) Performance

AIM Photonics superior MPW performance is the result of new, ultra low-loss waveguides, featuring attenuation that is less than .25 and .10dB/cm for 220nm silicon and 220nm silicon nitride (SiN), respectively, in addition to around 1dB/facet edge coupler for both transverse electric (TE) and transverse magnetic (TM) polarization. With only 90-day fabrication time for full actives to be processed on 300mm silicon on insulator (SOI) wafers, and using the same toolset that produces 14nm and smaller circuits, these capabilities also enable easy transfer to similar high-volume equipped foundries if needed.

Air Force Research Laboratory awards grant to develop devices for neuromorphic computing

Air Force Research Laboratory awards grant to develop devices for neuromorphic computing

Dr. Papa Rao, Prof. Cady and the NY CREATES team work towards artificial neuron circuits that communicate with 1.22 µm light and use superconducting Josephson junctions for energy-efficient operation at speeds 30,000 times faster than the brain’s neurons.

Over 2000 students complete first online PIC design course

Over 2000 students complete first online PIC design course

AIM Academy offers first online PIC design course, lead by Dr. Stefan Preble of RIT, with over 2000 students. AIM Academy also announces a new PIC Bootcamp for 2020.

Governor Andrew M. Cuomo announces that IBM plans to invest over $2 billion to grow its high-tech footprint at the Albany campus and throughout New York State.

Governor Andrew M. Cuomo announces that IBM plans to invest over $2 billion to grow its high-tech footprint at the Albany campus and throughout New York State.

Governor Andrew Cuomo announces a $2 billion investment by NYS and IBM to grow the company’s high-tech footprint at NY CREATES and throughout New York State. New York State invests $300 million over five years to support the the establishment of an “AI Hardware Center” for artificial intelligence-focused computer chip research, development, prototyping, testing and simulation.

Letter of Intent signed to join the Quantum Economic Development Consortium (QED-C)

Letter of Intent signed to join the Quantum Economic Development Consortium (QED-C)

QED-C is one of the premier initiatives of the National Quantum Initiative, an industry-driven consortium run by SRI, and supported by the National Institute of Standards and Technology

NYS leaders and Cree, Inc. announce plans to invest approximately $1 billion over six years to construct and equip a new, state-of-the-art, 200 mm silicon carbide wafer fabrication facility

NYS leaders and Cree, Inc. announce plans to invest approximately $1 billion over six years to construct and equip a new, state-of-the-art, 200 mm silicon carbide wafer fabrication facility

Cree, Inc., the global leader in silicon carbide technology, will construct and equip the world’s-first 200 mm silicon carbide wafer fabrication facility at the Marcy Nanocenter on the SUNY Polytechnic Institute campus near Utica. While construction is underway, Cree will lease space at NY CREATES, where the company will utilize equipment purchased as part of the New York Power Electronics Manufacturing Consortium (NY-PEMC) to transition from the current process of producing devices on 150 mm silicon carbide wafers to producing devices on 200 mm silicon carbide wafers.

AIM Photonics produces first fully integrated 300mm Quantum Photonic wafer

AIM Photonics produces first fully integrated 300mm Quantum Photonic wafer

The quantum photonics wafer project is led by the Air Force Research Laboratory and RIT. The wafer includes chip designs from both RIT and Air Force Research Laboratory, along with designs by collaborators at MIT, Purdue University, Oak Ridge National Laboratory, Army Research Laboratory, and Rensselaer Polytechnic Institute. The wafer was fabricated by AIM Photonics in NY CREATES’ advanced 300mm microelectronics facility in Albany, N.Y.

AIM Photonics announces latest version of PDK v3.5 addressing Design for Manufacturability

AIM Photonics announces latest version of PDK v3.5 addressing Design for Manufacturability

AIM Photonics PDK v3.0 announced. Industry leaders recognize AIM PDK as industry leading. The release of Process Design Kit (PDK) v3.5 Compact Model Library sponsored by AIM Photonics is the first to support statistical models in Lumerical’s INTERCONNECT, introducing a set of statistical models based on the measured wafer-scale data of photonic components.

The formal launch of NY CREATES

The formal launch of NY CREATES

Empire State Development (ESD) and the State University of New York (SUNY) today announced the New York Center for Research, Economic Advancement, Technology, Engineering and Science, or NY CREATES, held its first board meeting and is formally leading operations of Fuller Road (FRMC) and Fort Schuyler (FSMC) Management Corporations.

300mm Fabrication of Superconducting Quantum Computing Devices

300mm Fabrication of Superconducting Quantum Computing Devices

This project will establish a first-of-its-kind capability at 300mm wafer scale that will lead towards scalable quantum computing devices, with higher performance characteristics.

AIM Photonics awarded funding through CARES Act for COVID-19 research

AIM Photonics awarded funding through CARES Act for COVID-19 research

US DoD invests over $2 million in support of advanced integrated photonics biomedical sensor research to detect COVID-19 with Professor Ben Miller of University of Rochester and Ortho Clinical Diagnostics.

AIM Photonics celebrates its 5th anniversary

AIM Photonics celebrates its 5th anniversary

AIM Photonics enters fifth year with over 120 members, industry leading MPW program, PDK, and first ever world-class open-access 300mm wafer test, assembly and packaging facility online and accepting customers.  In celebration of AIM Photonics 5 year anniversary and the technical achievements, AIM Photonics and DoD partners present a look into the institute. The national broadcast on Information Matrix will be hosted by award-winning actor Laurence Fishburne on more than 200 public television stations beginning the week of May 25, 2020, and features some of the incredible innovations and applications of integrated photonics.

NY CREATES and Seeqc begin work towards the fabrication of fluxonium qubits

NY CREATES and Seeqc begin work towards the  fabrication of fluxonium qubits

Seeqc and NY CREATES team to establish the design and process parameters required to fabricate fluxonium qubits on 300mm silicon wafers using state-of-the-art tools at the NY CREATES fab in Albany, NY. Funded by Air Force Research Lab STTR Phase I grant.

AIM Photonics announces new leadership

AIM Photonics announces new leadership

Mike Cumbo announced as new CEO and Executive in charge of AIM Photonics beginning July 1st, 2020.

NY CREATES / SUNY Poly is a partner of the Co-Design Center for Quantum Advantage, funded by Department of Energy

NY CREATES / SUNY Poly is a partner of the Co-Design Center for Quantum Advantage, funded by Department of Energy

C2QA, led by Brookhaven National Lab along with 23 other partners, is one of centers funded by National Quantum Initiative. C2QA is working on the tools necessary to create scalable, distributed and fault-tolerant quantum computing systems.