December 9, (Wednesday) 2020
1:30 PM – 2:30 PM EST
Virtual via SEMICONDUCTOR DIGEST
AGENDA
• NY CREATES – AIM Photonics update: Mike Cumbo
• Test, Assembly and Packaging (TAP) capabilities review: Ed White
• Examples of recent success stories and lessons learned: Ed White
• Q&A
ABSTRACT
Join NY CREATES and AIM Photonics as they present the latest technology achievements at the TAP Facility. Hear from Mike Cumbo and Ed White, who will present the latest capabilities and recent program successes including; fiber attach, wire bonding, dicing, and others. Learn how the facility is playing an essential part in supporting COVID-19 sensor chip development, and other key programs. Hear about future packaging, test, and assembly technologies for both photonic and microelectronic research.
ABOUT TAP
The TAP facility is New York State’s premier microelectronic packaging facility, and is the only open-access 300mm facility of its kind in the world. Join our webcast to see how we are changing packaging, test, and assembly as we know it, and how you can play a part in driving this essential new technology of the future.