NY CREATES is proud to forge large-scale collaborations with industry leaders
in a variety of high technology areas of strategic importance to the economy for the next several decades. These range from power electronics to integrated photonics, from artificial intelligence to quantum computing. In addition to leveraging New York State’s leadership in advanced technology, these partnerships are designed to support the economic vitality and dynamic innovation that has characterized the United States over more than two centuries.
NY CREATES is working with Cree to develop the world’s first 200 mm SiC fab in upstate New York. Until the completion of its Mohawk Valley fab, Cree is utilizing NY PEMC’s SiC process equipment at Albany. As the fab ramps, Cree will transfer the NY PEMC equipment and its 200 mm process to the Marcy, NY site. Since 2017, NY PEMC and Danfoss have been working on SiC power module production lines – the first by Danfoss in New York State.
The IBM Research AI Hardware Center is a part of IBM’s global research network, and is headquartered in Albany, NY. The Center, which includes SUNY Polytechnic Institute, Rensselaer Polytechnic Institute, Applied Materials and Tokyo Electron Ltd among its partners, works on new materials, devices and next-generation chips required to speed the development of AI to its full potential.
The Materials Engineering Technology Accelerator (META Center), a first-of-its-kind facility aimed at speeding customer prototyping of new materials, process technologies and devices. As chipmaking becomes increasingly challenging, the META Center extends Applied’s ability to collaborate with customers to pioneer new ways of improving chip performance, power and cost.
At the META Center, engineers can evaluate novel chip materials, structures and devices, testing them in a robust pilot manufacturing environment and accelerating their readiness for customer high-volume manufacturing facilities. Among the first chip devices under evaluation at the META Center is a new magnetic random-access memory (MRAM) targeted at Internet of Things devices, providing low-power, nonvolatile code storage and high-density working memory.
AIM Photonics seeks to advance integrated photonic circuit manufacturing technology development while simultaneously providing access to state-of-the-art fabrication, packaging and test capabilities for small-to-medium enterprises, academia, and the government. It seeks to meet commercial, defense and civilian agency needs in the growing area of integrated photonics. Its mission also includes helping create a workforce capable of meeting industry needs. AIM Photonics vision is to establish a technology, business and education framework for industry, government and academia to accelerate the transition of integrated photonics solutions from innovation to manufacturing-ready deployment in systems spanning commercial and defense applications.
The Center for Semiconductor Research is an established partnership with the leading companies in the semiconductor industry. It is a long-term, multi-phase, joint R&D cooperative program that began with work on the 32 nanometer CMOS node and has continued over the past twenty years, with industry-leading announcements of R&D into the 7 nm and 5 nm CMOS nodes. Its mandate has included work on graphene-based devices, on neuromorphic computing and other AI-enabling hardware.
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