Skip to content

INFRASTRUCTURE

Infrastructure and Capabilities

  • Full suite of leading-edge, industry-relevant 300mm process tools capable of 7-5nm node CMOS development
  • Wide range of lithographic capabilities (MUV, 193i, EUV) / EUV patterning technology development with industry leaders
  • 100K ft2, Class-1 capable cleanroom space / Multi-tenant semiconductor operations, and intellectual property management
  • Industry-standard fab control methods, WIP tracking and analyses, and results reporting / Quality management system (QMS) capable of fabricating ISO 9001:2015 products
  • 24/7 pilot line operation / Capacity of >10,000 full-flow wafer starts per year or >40,000 short-loop wafer starts per year
  • Fabrication of 65nm customer designs on established CMOS process flow
  • Full complement of on-site analytical services and testing capability
  • Flexibility for advanced R&D uniquely combined with operational discipline

FEATURED NEWS

Explore Recent News

Review upcoming topics and learn about
speakers featured in our Emergent Technologies Seminar Series. 

RELATED RESOURCES

Dive Deeper

Learn about the latest technologies with presentations and papers co-authored by members of the NY CREATES team. 

PLAN A VISIT

Go Behind The Scenes

Start your NY CREATES dialogue with a few words about your technology and collaborative interests using the link below.