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NY Creates
Extreme Ultraviolet Lithography Center

Creates EUV Center offers standard NA, and soon, High NA EUV lithography capabilities that don’t exist anywhere else in the world within an accessible semiconductor R&D ecosystem.

3400B EUV Lithography Tool for semiconductor manufacturing
3400B EUV Lithography Tool for semiconductor manufacturing

NY Creates
Extreme Ultraviolet Lithography Center

NY CREATES EUV Center offers standard NA, and soon, High NA EUV lithography capabilities that don’t exist anywhere else in the world within an accessible semiconductor R&D ecosystem.

Creates’ EUV Lithography Center features:

Standard NA EUV Lithography R&D and prototyping, to the 2nm node

North America’s first and only non-profit owned research and development center which will also utilize High NA Extreme Ultraviolet (EUV) Lithography to drive sub-2nm technology development

Infographic showing -EUV Lithography Tools and logic technology scaling from 65nm to
Infographic showing -EUV Lithography Tools and logic technology scaling from 65nm to

Creates High NA EUV Lithography Center

In partnership with industry leaders, including IBM, Micron, Applied Materials, Tokyo Electron, and others, Creates’ High NA EUV Lithography Center will:

Support R&D of the world’s most complex and powerful semiconductor chips, including advanced AI GPUs, Large Language Models (LLMs), and high-performance computing (HPC)

Ensure critical support of future semiconductor supply chain innovation

Drive U.S. semiconductor innovation at leading-edge nodes

Enable opportunities to train the next-generation innovation workforce

Support R&D of the world’s most complex and powerful semiconductor chips, including advanced AI GPUs, Large Language Models (LLMs), and high-performance computing (HPC)

Drive U.S. semiconductor innovation at leading-edge nodes

Ensure critical support of future semiconductor supply chain innovation

Enable opportunities to train the next-generation innovation workforce

The High NA EUV Lithography Center is based at Creates’ Albany NanoTech Complex, North America’s largest and most advanced 300mm semiconductor R&D facility. Key capabilities—including some of the most innovative High NA EUV technology ever produced—ASML’s TWINSCAN EXE:5200B—will be leveraged inside NY CREATES’ accessible, new NanoFab Reflection (NFR) building.

NFR features 50,000 sq. ft. of state-of-the-art cleanroom space—complementing the existing advanced EUV capabilities at Creates, encouraging partner growth and supporting critical initiatives.

Creates’ Albany NanoTech Complex has:

  • Nation-leading semiconductor infrastructure and R&D capabilities
  • A proven track record of semiconductor breakthroughs and first-ever quantum photonic chips
  • Extensive partnerships with industry leaders, academic institutions, and government agencies
  • A highly skilled workforce and expertise in semiconductor innovation
  • Accessible standard NA EUV capabilities right now, and High NA EUV capabilities in 2026

Creates and industry partners are committed to integrating sustainability into the construction and operation of the High NA EUV Lithography Center, including in fab design, materials use, waste reuse, and sustainable fabrication processes.

What is EUV technology?

Albany NanoTech employees in front of EUV Lithography Tool

The Science Behind the Fabrication of Next-Gen Chips

Extreme ultraviolet (EUV) lithography uses EUV light to print the most complex, intricate layers on microchips. The EUV light has a wavelength of 13.5nm, which is near X-ray range. Creates offers this capability now as part of its EUV Lithography Center’s offerings.

How does High NA EUV work?

Numerical aperture (NA) is the measure of how finely a lithography system can focus light—higher NA means better resolution and smaller features. The NA for High NA EUV lithography is 0.55, which is considerably larger than the previous EUV generation’s 0.33. This means light from a wider angular range can be used for imaging. A High NA EUV tool focuses laser-driven plasma light through precision optics, enabling smaller and more complex chip features, ultimately leading to chips with greater computing power which simultaneously consume less energy.

Benefits of High NA EUV over traditional EUV:

  • Enhanced imaging resolution for next-gen chips
  • Improved chip functionality, performance, and energy efficiency
  • Key enabler for sub-2nm logic and advanced memory
  • Helps meet growing global demand for AI, mobile, and defense tech

Fun facts about the new High NA EUV tool:

As large as a double-decker bus

Arrives in 250 crates, 43 containers, on 5 cargo planes, and in 20 semi-trucks

Weighs more than 200 tons

Shoots plasma heated to 220,000°C—40x the temperature of the surface of the sun

To provide an idea of the technological scale, a 2nm chip the size of your fingernail is composed of 50 billion transistors, or on-off switches. High NA EUV will push the boundaries even further.

Explore the Future of U.S. Semiconductor Innovation

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