The formation of the New York Power Electronics Manufacturing Consortium (NY-PEMC), with GE as a lead partner, will help develop the next generation of materials used on semiconductors at the NY CREATES facilities in Albany. NY CREATES is providing support for operations, manufacturing and research and development activities of the NY-PEMC Silicon Carbide manufacturing line that will develop low cost, high performance 150 mm silicon carbide wafers.
Danfoss Silicon Power, one of the world’s leading, independent custom power module manufacturers, will occupy the entire Computer Chip Commercialization Center in Utica (QUAD-C) facility in Utica. This project supports and advances the New York Power Electronics Manufacturing Consortium, a public-private partnership along the Upstate corridor for development of the next generation of semiconductor materials and packaging. Danfoss Silicon Power will be manufacturing power modules for industrial products such as wind turbines, utility-scale solar inverters, data centers and electric cars.
Cree, Inc., the global leader in silicon carbide technology, will construct and equip the world’s-first 200 mm silicon carbide wafer fabrication facility at the Marcy Nanocenter on the SUNY Polytechnic Institute campus near Utica. While construction is underway, Cree will lease space at NY CREATES, where the company will utilize equipment purchased as part of the New York Power Electronics Manufacturing Consortium (NY-PEMC) to transition from the current process of producing devices on 150 mm silicon carbide wafers to producing devices on 200 mm silicon carbide wafers.
